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Koch Chemie Micro Cut Pad 76mm is a high-quality special sponge for removing light scratches, holograms and polishing marks using Micro Cut M3.02.
Lower torsional forces, very good handling and maximum stability are created by the low height of 23mm.
The special density of the foam material enables long-lasting compression hardness during polishing. The optimal reticulation (open cells) and cell count contribute to a permanent high-gloss finish and very good hygiene factors. The milling edge ensures greater flexibility of the pad to better adapt to contours.
The colored fleece, matching the polishes, ensures process reliability.
Compressive strength: 10
Abrasiveness: 5
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